中文|ENG
MR133

SLAM / VSLAM智能掃地機高性能解決方案

產品

芯片框圖

MR133

基本規格

CPU

? Quad-core ARM Cortex?-A7@1.8GHz
? 32KB L1 I-cache + 32KB L1 D-cache per core
? 512KB L2 cache
? Low-power CoolFlex? power management architecture

GPU

? Mali400 MP2
? Supports OpenGL ES 2.0/1.1, Direct3D 11.1, OpenVG 1.1

Memory

? Supports 32-bit DDR4/DDR3/DDR3L/LPDDR3/LPDDR4
? Supports eMMC 5.0, compatible with eMMC 5.1, support Full Disk Encryption(FDE)
? Supports 8-bit TLC/MLC/SLC/EF NAND flash, supports FDE
? Supports LDPC/80-bit BCH/1024bytes

Video Engine

? Supports H264 HP encoder 1080P@60fps
? Supports 3-bit rate control: CBR, VBR, FIXQP
? Supports JPEG encoder 4096 x 4096

Video Input

? Compliant with MIPI-CSI2 V1.00 and MIPI DPHY V1.00.00
? 1/2/3/4 Data Lanes Configuration and up to 1Gbps per Lane in HS Transmission
? Maximum to 13M@15fps, or 8M@30fps with 4 data lane
? Supports format: YUV422-8bit/10bit, YUV420-8bit, RAW-8, RAW-10, RAW-12, RGB888, RGB565

ISP

? Maximum picture resolution of 4224x3168
? Adjustable 3A functions, including automatic exposure(AE), automatic white balance(AWB) and automatic focus (AF)
? Supports spatial(2D) de-noise filter
? Supports contrast enhance and sharping
? Supports chrominance noise reduction
? Supports defect pixel correction

Memory

? Supports two audio DAC and one audio ADC
? Supports Three analog audio inputs and one analog audio outputs
? Capless stereo headphone driver
? Up to two I2S/PCM controllers for connecting Bluetooth and external audio codec
? Integrated digital microphone, supports maximum 8 digital microphones

Security Engine

? Supports Symmetrical algorithm: AES,DES,3DES,XTS
? Supports Hash algorithm: MD5,SHA,HMAC
? Supports Pubic Key algorithm: RSA, ECC
? Supports 160-bit hardware PRNG with 175-bit seed
? Supports 256-bit hardware TRNG
? Supports 2.5K-bit EFUSE for chip ID and security application

Connectivity

? USB Host, USB 2.0 OTG
? SDIO 3.0, RSB
? 4 x TWI, 2 x SPI
? 6 x UART, 3 x PWM
? GPADC, KEYADC

WIFI

? XR829 or others

OS

? Tina、Android 8.1 or above

PMIC

? PMU AXP2585
? BMU AXP15060

Package

? FBGA 413balls
? 12.3mm x 12.8mm size,0.5 ball pitch,0.3 ball size

Process

? 28nm HPC

方案亮點

高性能與高能效的雙重提升
高性能與高能效的雙重提升
13MP Camera +ISP 配置
13MP Camera +ISP 配置
強大的多媒體支持
強大的多媒體支持
接口豐富 2路USB2.0、2路SPI、4路TWI、6路UART、3路PWM、KEYADC, GPADC, SDIO3.0, etc.
接口豐富 2路USB2.0、2路SPI、4路TWI、6路UART、3路PWM、KEYADC, GPADC, SDIO3.0, etc.

典型機型

MR133

相關新聞

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